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課程目標:
This course will introduce the current challenge in the thermal management of electronic devices, and some commonly used methods to dissipate heat from electronic system (From simple air cooling to heat pipe). Following by advanced heat dissipation methods and the pros and cons in each method.
授課內容:
This is a lecture-based classes including homework and a presentation is required at the end of the semester.
Schedule for each week
1: Course introduction
2/3: Air cooling
4/5/6: Single phase liquid cooling
7/8: Pool boiling
9: Midterm
10/11: Flow Boiling
12: Thin film evaporation
13/14: Condensation
15: Heat pipe
16: Final exam