課程目標:

This course will introduce the current challenge in the thermal management of electronic devices, and some commonly used methods to dissipate heat from electronic system (From simple air cooling to heat pipe). Following by advanced heat dissipation methods and the pros and cons in each method.

授課老師:陳冠廷老師

授課內容:

This is a lecture-based classes including homework and a presentation is required at the end of the semester.

Schedule for each week

1: Course introduction

2/3: Air cooling

4/5/6: Single phase liquid cooling

7/8: Pool boiling

9: Midterm

10/11: Flow Boiling

12: Thin film evaporation

13/14: Condensation

15: Heat pipe

16: Final exam

詳情請見→授課大綱(https://cis.ncu.edu.tw/AcademicSys/api/curriculumQuery?semester=1132&courseNo=ME6077%2A)

影片來源：工學院機械系

NCUx數位雲端課程：https://ncuxms.ncu.edu.tw/course/729